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MC-4R256FKK8K Fiches technique(PDF) 1 Page - Elpida Memory |
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MC-4R256FKK8K Fiches technique(HTML) 1 Page - Elpida Memory |
1 / 13 page Document No. E0253N10 (Ver. 1.0) Date Published April 2002 (K) Japan URL: http://www.elpida.com Elpida Memory, Inc. 2002 Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd. PRELIMINARY DATA SHEET 256MB 32-bit Direct Rambus DRAM RIMM Module MC-4R256FKK8K (64M words ×××× 18 bits ×××× 2 channels) Description The 32-bit Direct Rambus RIMM module is a general- purpose high-performance lines of memory modules suitable for use in a broad range of applications including computer memory, personal computers, workstations, and other applications where high bandwidth and latency are required. The 32-bit RIMM module consists of 288Mb Direct Rambus DRAM (Direct RDRAM) devices. These are extremely high-speed CMOS DRAMs organized as 16M words by 18 bits. The use of Rambus Signaling Level (RSL) technology permits the use of conventional system and board design technologies. The 32-bit RIMM modules support 800MHz transfer rate per pin, resulting in total module bandwidth of 3.2GB/s. The 32-bit RIMM module provides two independent 18 bit memory channels to facilitate compact system design. The "Thru" Channel enters and exits the module to support a connection to or from a controller, memory slot, or termination. The "Term" Channel is terminated on the module and supports a connection from a controller or another memory slot. The RDRAM architecture enables the highest sustained bandwidth for multiple, simultaneous, randomly addressed memory transactions. The separate control and data buses with independent row and column control yield over 95% bus efficiency. The RDRAM device multi-bank architecture supports up to four simultaneous transactions per device. Features • 256MB Direct RDRAM storage and 256 banks total on module • 2 independent Direct RDRAM channels, 1 pass through and 1 terminated on 32-bit RIMM module • High speed 800MHz Direct RDRAM devices • 232 edge connector pads with 1mm pad spacing Module PCB size: 133.35mm × 39.925mm × 1.27mm Gold plated edge connector pads contacts • Serial Presence Detect (SPD) support • Operates from a 2.5V (±5%) supply • Low power and power down self refresh modes • Separate Row and Column buses for higher efficiency |
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