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AD8229 Fiches technique(PDF) 6 Page - Analog Devices

No de pièce AD8229
Description  1 nV/Hz Low Noise 210C Instrumentation Amplifier
Download  24 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD8229 Fiches technique(HTML) 6 Page - Analog Devices

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AD8229
Data Sheet
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±17 V
Output Short-Circuit Current Duration
Indefinite
Maximum Voltage at –IN, +IN1
±VS
Differential Input Voltage1
Gain ≤ 4
±VS
4 > Gain > 50
±50 V/gain
Gain ≥ 50
±1 V
Maximum Voltage at REF
±VS
Storage Temperature Range
−65°C to +150°C
Specified Temperature Range
SBDIP
−40°C to +210°C
SOIC
−40°C to +175°C
Maximum Junction Temperature
SBDIP
245°C
SOIC
200°C
ESD
Human Body Model
4 kV
Charge Device Model
1.5 kV
Machine Model
200 V
1
For voltages beyond these limits, use input protection resistors. See the
Theory of Operation section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME VS. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the AD8229.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism assump-
tions. HTOL is performed to JEDEC JESD22-A108. A minimum
of three wafer fab and assembly lots are processed through
HTOL at the maximum operating temperature. Comprehensive
reliability testing is performed on all Analog Devices, Inc., high
temperature (HT) products.
1
100k
10k
1k
100
10
120
210
200
190
180
170
160
150
140
130
OPERATING TEMPERATURE (°C)
Figure 3. Predicted Lifetime vs. Operating Temperature
Refer to the AD8229 Predicted Lifetime vs. Operating Temperature
document for the most up-to-date reliability data.
THERMAL RESISTANCE
θJA is specified for a device in free air using a 4-layer JEDEC
printed circuit board (PCB).
Table 3.
Package Type
θJA
Unit
8-Lead SBDIP
100
°C/W
8-Lead SOIC
121
°C/W
ESD CAUTION


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