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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SI7905DN-T1-GE3 Fiches technique(PDF) 9 Page - Vishay Siliconix |
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SI7905DN-T1-GE3 Fiches technique(HTML) 9 Page - Vishay Siliconix |
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9 / 13 page  www.vishay.com 2 Document Number 71681 03-Mar-06 Vishay Siliconix AN822 PowerPAK 1212 DUAL To take the advantage of the dual PowerPAK 1212-8’s thermal performance, the minimum recommended land pattern can be found in Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this doc- ument. The gap between the two drain pads is 10 mils. This matches the spacing of the two drain pads on the Pow- erPAK 1212-8 dual package. This land pattern can be extended to the left, right, and top of the drawn pattern. This extension will serve to increase the heat dissipation by decreasing the ther- mal resistance from the foot of the PowerPAK to the PC board and therefore to the ambient. Note that increasing the drain land area beyond a certain point will yield little decrease in foot-to-board and foot-to- ambient thermal resistance. Under specific conditions of board configuration, copper weight, and layer stack, experiments have found that adding copper beyond an area of about 0.3 to 0.5 in2 of will yield little improve- ment in thermal performance. REFLOW SOLDERING Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humid- ity, HAST, or pressure pot. The solder reflow tempera- ture profile used, and the temperatures and time duration, are shown in Figures 2 and 3. For the lead (Pb)-free solder profile, see http://www.vishay.com/ doc?73257. Ramp-Up Rate + 6 °C /Second Maximum Temperature at 155 ± 15 °C 120 Seconds Maximum Temperature Above 180 °C 70 - 180 Seconds Maximum Temperature 240 + 5/- 0 °C Time at Maximum Temperature 20 - 40 Seconds Ramp-Down Rate + 6 °C/Second Maximum Figure 2. Solder Reflow Temperature Profile Figure 3. Solder Reflow Temperatures and Time Durations 210 - 220 °C 3 ° C/s (max) 4 ° C/s (max) 10 s (max) 183 °C 50 s (max) Reflow Zone 60 s (min) Pre-Heating Zone 3° C/s (max) 140 - 170 °C Maximum peak temperature at 240 °C is allowed. |
Numéro de pièce similaire - SI7905DN-T1-GE3 |
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Description similaire - SI7905DN-T1-GE3 |
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