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TS68882MR25 Fiches technique(PDF) 7 Page - ATMEL Corporation |
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TS68882MR25 Fiches technique(HTML) 7 Page - ATMEL Corporation |
7 / 43 page 7 TS68882 2119A–HIREL–04/02 Package The macrocircuits are packaged in hermetically sealed ceramic packages which are conform to case outlines of MIL-STD-1835 (when defined): • 68-PIN SQ.PGA UP PAE Outline • 68-PIN Ceramic Quad Flat Pack CQFP The precise case outlines are described on Figure 23 and Figure 24. Electrical Characteristics Recommended Condition of Use Unless otherwise stated, all voltages are referenced to the reference terminal (see Table 1). Notes: 1. Test load, see Figure 5. 2. Capacitance is periodically sampled rather than 100% tested. Table 2. Absolute Maximum Ratings Symbol Parameter Test Conditions Min Max Unit VCC Supply Voltage -0.3 +7.0 V VI Input Voltage -0.3 +7.0 V P DMAX Max Power Dissipation T CASE =-55°Cto +125°C 0.75 W TCASE Operating Temperature M Suffix -55 +125 °C VSuffix -40 +85 °C TSTG Storage Temperature -55 +150 °C TLEADS Lead Temperature Max 5 sec. Soldering +270 °C Table 3. DC Electrical Characteristics V CC =5.0 VDC ± 10%; GND = 0 VDC;Tc= -55°C to +125°C Symbol Parameter Min Max Unit V CC Supply Voltage 4.5 5.5 V T CASE Operating Temperature -55 +125 °C VIH Input High Voltage 2.0 VCC V VIL Input Low Voltage GND - 0.3 0.8 V IIN Input Leakage Current at 5.5V CLK, RESET,R/W,A0-A4, CS,DS, AS, SIZE 10 µA ITSI HI-Z (Off state) Input Current at 2.4V/0.4V DSACK0, DSACK1,D0-D31 20 µA V OH Output High Voltage (IOH = -400 µA) (1) DSACK0, DSACK1,D0-D31 2.4 V V OL Output Low Voltage (IOL = 5.3 mA) (1) DSACK0, DSACK1,D0-D31 0.5 V IOL Output Low Current (VOL = GND) SENSE 500 µA PD Power Dissipation 0.75 W CIN Capacitance (VIN =0, TA =25°C, f = 1 MHz) (2) 20 pF CL Output Load Capacitance 130 pF |
Numéro de pièce similaire - TS68882MR25 |
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Description similaire - TS68882MR25 |
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