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DAC8143 Fiches technique(PDF) 4 Page - Analog Devices |
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DAC8143 Fiches technique(HTML) 4 Page - Analog Devices |
4 / 12 page DAC8143 –4– REV. C PIN CONNECTIONS 16-Lead Epoxy Plastic DIP 16-Lead SOIC TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 IOUT1 RFB DAC8143 IOUT2 VREF AGND VDD STB1 CLR LD1 DGND SRO STB4 SRI STB3 STB2 LD2 ABSOLUTE MAXIMUM RATINGS (TA = +25 °C, unless otherwise noted.) VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 25 V VRFB to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to VDD Output Voltage (Pin 1, Pin 2) . . . . . . . . . . . . . . –0.3 V to VDD Operating Temperature Range FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Storage Temperature . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 °C Package Type JA* JC Units 16-Lead Plastic DIP 76 33 °C/W 16-Lead SOIC 92 27 °C/W * θ JA is specified for worst case mounting conditions, i.e., θ JA is specified for device in socket for P-DIP package; θ JA is specified for device soldered to printed circuit board for SOIC package. CAUTION 1. Do not apply voltage higher than VDD or less than DGND po- tential on any terminal except VREF (Pin 15) and RFB (Pin 16). 2. The digital control inputs are Zener-protected; however, permanent damage may occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam at all times until ready to use. 3. Use proper antistatic handling procedures. 4. Absolute Maximum Ratings apply to packaged devices. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. ORDERING GUIDE Gain Temperature Package Package Model Nonlinearity Error Range Descriptions Options DAC8143FP ±1 LSB ±2 LSB –40 °C to +85°C 16-Lead Plastic DIP N-16 DAC8143FS ±1 LSB ±2 LSB –40 °C to +85°C 16-Lead SOIC R-16W Die Size: 99 × 107 mil, 10,543 sq. mils. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
Numéro de pièce similaire - DAC8143 |
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Description similaire - DAC8143 |
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