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LM2586SX-3.3 Fiches technique(PDF) 6 Page - Texas Instruments |
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LM2586SX-3.3 Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 38 page LM2586 SNVS121D – MAY 1996 – REVISED APRIL 2013 www.ti.com LM2586-ADJ (continued) Symbol Parameters Conditions Typical Min Max Units ICL NPN Switch Current Limit 4.0 3.0 7.0 A VSTH Synchronization FSYNC = 200 kHz 0.75 0.625/0.40 0.875/1.00 V Threshold Voltage VCOMP = 1V, VIN = 5V ISYNC Synchronization VIN = 5V 100 200 μA Pin Current VCOMP = 1V, VSYNC = VSTH VSHTH ON/OFF Pin (Pin 1) VCOMP = 1V 1.6 1.0/0.8 2.2/2.4 V Threshold Voltage (7) ISH ON/OFF Pin (Pin 1) VCOMP = 1V 40 15/10 65/75 μA Current VSH = VSHTH θJA Thermal Resistance NDZ Package, Junction to 65 Ambient (8) θJA NDZ Package, Junction to 45 Ambient (9) θJC NDZ Package, Junction to Case 2 θJA KTW Package, Junction to 56 °C/W Ambient (10) θJA KTW Package, Junction to 35 Ambient (11) θJA KTW Package, Junction to 26 Ambient (12) θJC KTW Package, Junction to Case 2 (7) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency adjust circuit will begin operation (Figure 55). (8) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area. (9) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads. (10) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper. (11) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. (12) Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple® software. 6 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: LM2586 |
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Description similaire - LM2586SX-3.3 |
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