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2PA1774RMB Fiches technique(PDF) 8 Page - NXP Semiconductors |
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2PA1774RMB Fiches technique(HTML) 8 Page - NXP Semiconductors |
8 / 12 page 2PA1774XMB_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 23 March 2012 8 of 12 NXP Semiconductors 2PA1774xMB series 40 V, 100 mA PNP general-purpose transistors 11. Soldering Reflow soldering is the only recommended soldering method. Fig 8. Reflow soldering footprint DFN1006B-3 (SOT883B) 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2x) 0.4 (2x) 0.25 (2x) R0.05 (8x) 0.7 Footprint information for reflow soldering SOT883B sot883b_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm |
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