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AM29LV400B-90RSIB Fiches technique(PDF) 6 Page - Advanced Micro Devices |
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AM29LV400B-90RSIB Fiches technique(HTML) 6 Page - Advanced Micro Devices |
6 / 40 page Am29LV400 6 PREL I M I N AR Y Special Handling Instructions for Fine PItch Ball Grid Array (FBGA) Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. T he pac k age and/or data integrit y m a y be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. PIN CONFIGURATION A0–A17 = 18 addresses DQ0–DQ14 = 15 data inputs/outputs DQ15/A-1 = DQ15 (data input/output, word mode), A-1 (LSB address input, byte mode) BYTE# = Selects 8-bit or 16-bit mode CE# = Chip enable OE# = Output enable WE# = Write enable RESET# = Hardware reset pin, active low RY/BY# = Ready/Busy# output VCC = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VSS = Device ground NC = Pin not connected internally LOGIC SYMBOL 20514C-4 18 16 or 8 DQ0–DQ15 (A-1) A0–A17 CE# OE# WE# RESET# BYTE# RY/BY# |
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