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AMC6821SDBQG4 Fiches technique(PDF) 2 Page - Texas Instruments |
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AMC6821SDBQG4 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 56 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) AMC6821 SBAS386C – MAY 2006 – REVISED JULY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PRODUCT PACKAGE-LEAD DESIGNATOR RANGE PACKAGE MARKING AMC6821SDBQ QSOP-16 DBQ –40 °C to +125°C 6821S (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Over operating free-air temperature range (unless otherwise noted). VALUE UNIT VDD to GND –0.3 to +6.5 V Digital input voltage to GND –0.3 to +6.5 V Input current 10 mA Select pins A0, A1, PWM-MODE to GND –0.3 to VDD + 0.3 V Analog input voltage to GND –0.3 to VDD + 0.3 V Operating temperature range –40 to +125 °C Storage temperature range –65 to +150 °C Junction temperature (TJ Max) +150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 2 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Link(s): AMC6821 |
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