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BFC233820683 Fiches technique(PDF) 11 Page - Vishay Siliconix

No de pièce BFC233820683
Description  Interference Suppression Film Capacitors MKP Radial Potted Type
Download  16 Pages
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Fabricant  VISHAY [Vishay Siliconix]
Site Internet  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

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MKP338 2 X2
www.vishay.com
Vishay BCcomponents
Revision: 04-Jul-13
11
Document Number: 28119
For technical questions, contact: rfi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Insulation resistance
APPLICATION NOTES
• For X2 electromagnetics interference suppression in standard across the line applications (50 Hz/60 Hz) with a maximum
mains voltage of 310 VAC.
• For series impedance applications we refer to application note www.vishay.com/doc?28153
• For capacitors connected in parallel, normally the proof voltage and possibly the rated voltage must be reduced. For
information depending of the capacitance value and the number of parallel connections contact: rfi@vishay.com
• These capacitors are not intended for continuous pulse applications. For these situations, capacitors of the AC and pulse
programs must be used.
• The maximum ambient temperature must not exceed 105 °C (125 °C for less than 1000 h) for C
 470 nF and 110 °C for
C > 470 nF
• Rated voltage pulse slope:
If the pulse voltage is lower than the rated voltage, the values of the specific reference data can be multiplied by 435 VDC and
divided by the applied voltage.
INSPECTION REQUIREMENTS
General Notes
Sub-clause numbers of tests and performance requirements refer to the “Sectional Specification, IEC Publication IEC 60384-14
ed-3” and “Specific Reference Data”.
GROUP C INSPECTION REQUIREMENTS
SUB-CLAUSE NUMBER AND TEST
CONDITIONS
PERFORMANCE REQUIREMENTS
SUB-GROUP C1A PART OF
SAMPLE OF SUB-GROUP C1
4.1 Dimensions (detail)
As specified in chapters “General Data” of this
specification
Initial measurements
Capacitance
Tangent of loss angle:
For C
 1 μF at 10 kHz
For C > 1 μF at 1 kHz
4.3 Robustness of terminations
Tensile: Load 10 N; 10 s
Bending: Load 5 N; 4 x 90°
No visible damage
4.4 Resistance to soldering heat
No pre-drying
Method: 1A
Solder bath: 280 °C ± 5 °C
Duration: 10 s
106
105
104
0
20
40
60
80
100
T
amb (°C)


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