2

Alpha Industries, Inc. [781] 935-5150

• Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com

Specifications subject to change without notice. 1/01A

Low Resistance Plastic Packaged PIN Diodes

SMP1322 Series

Series Resistance vs. Current @ 100 MHz

0.1

0.01

0.1

1

10

100

1

10

100

Forward Current (mA)

0

1

2

5

10

20

50

Capacitance vs. Reverse Voltage

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Reverse Voltage (V)

1 MHz–1 GHz

400

500

600

700

800

900

1000

DC Characteristic

0.01

0.1

1

10

100

Forward Voltage (mV)

0

500

1000

1500

2000

Conductance vs. Frequency

and Reverse Voltage

0

500

1000

1500

2000

2500

3000

Frequency (MHz)

0 V

10 V

40 V

Typical Performance Data

RR

R

R

R

-55°C

-15°C

+25°C

+65°C

+100°C

(mA)

(

Ω

Ω)(Ω

Ω)(Ω

Ω)(Ω

Ω)(Ω

Ω)

0.02

9.500

9.400

9.900

10.500

10.900

0.10

3.000

3.000

3.000

3.300

3.500

0.30

1.500

1.500

1.500

1.600

1.800

0.50

1.100

1.100

1.200

1.200

1.400

1.00

0.922

0.914

0.902

0.963

1.100

10.00

0.568

0.559

0.533

0.563

0.655

20.00

0.532

0.520

0.494

0.521

0.610

100.00

0.483

0.469

0.440

0.464

0.565

Resistance vs. Temperature @ 500 MHz

SMP1322-007

In the -007 configuration of the SOT-23 package, the package

inductance is effectively reduced to 0.4 nH, in comparison to

the 1.5 nH value of the standard configuration. This lower

inductance will be particularly beneficial when the diodes are

used as shunt connected switches at frequencies higher than

500 MHz, where inductance is the primary limitation on

maximum switch isolation.

To achieve the effective 0.4 nH, the SOT-23 package

must be inserted in the microstrip circuit board with a

gap in the trace, as shown

in the figure. Because

of the polarity of the

diode junction, this low

inductance feature is only

realizable with the cathode

connected to ground.

Ground

Gap