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HLMP-CE14-35CDD Fiches technique(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CE14-35CDD Fiches technique(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
7 / 9 page 7 Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Ammo Packs Drawing Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) Dwell time: 3 sec - 5 sec (maximum = 5 sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260°C Max 105°C Max A A 12.70±1.00 0.50±0.0394 20.50±1.00 0.807±0.039 18.00±0.50 0.7087±0.0197 9.125±0.625 0.3593±0.0246 12.70±0.30 0.50±0.0118 0.70±0.20 0.0276±0.0079 6.35±1.30 0.25±0.0512 4.00±0.20TYP. ø 0.1575±0.008 VIEW A-A CATHODE Note: All dimensions are in milimeters (inches). |
Numéro de pièce similaire - HLMP-CE14-35CDD |
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Description similaire - HLMP-CE14-35CDD |
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