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AD9249 Fiches technique(PDF) 10 Page - Analog Devices |
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AD9249 Fiches technique(HTML) 10 Page - Analog Devices |
10 / 36 page AD9249 Data Sheet Rev. 0 | Page 10 of 36 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD to GND −0.3 V to +2.0 V DRVDD to GND −0.3 V to +2.0 V Digital Outputs (D±x1, D±x2, DCO±1, DCO±2, FCO±1, FCO±2) to GND −0.3 V to +2.0 V CLK+, CLK− to GND −0.3 V to +2.0 V VIN±x1, VIN±x2 to GND −0.3 V to +2.0 V SCLK/DTP, SDIO/DFS, CSB1, CSB2 to GND −0.3 V to +2.0 V SYNC, PDWN to GND −0.3 V to +2.0 V RBIAS1, RBIAS2 to GND −0.3 V to +2.0 V VREF, VCM1, VCM2, SENSE to GND −0.3 V to +2.0 V Environmental Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS Typical θJAis specified for a 4-layer PCB with a solid ground plane. Airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces θJA. Table 7. Thermal Resistance (Simulated) Package Type Airflow Velocity (m/sec) θJA1, 2 ΨJT1,2 Unit 144-Ball, 10 mm × 10 mm CSP-BGA 0 30.2 0.13 °C/W 1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). ESD CAUTION |
Numéro de pièce similaire - AD9249 |
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Description similaire - AD9249 |
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