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AD7892BR-3 Fiches technique(PDF) 3 Page - Analog Devices |
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AD7892BR-3 Fiches technique(HTML) 3 Page - Analog Devices |
3 / 14 page ABSOLUTE MAXIMUM RATINGS* (TA = +25 °C unless otherwise noted) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to AGND AD7892-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±17 V AD7892-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD AD7892-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (A, B Versions) . . . . . . . . . . . –40 °C to +85°C Extended (S Version) . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Parameter A Versions 1 B Versions S Version 2 Unit Test Conditions/Comments LOGIC OUTPUTS Output High Voltage, VOH 4.0 4.0 4.0 V min ISOURCE = 200 µA Output Low Voltage, VOL 0.4 0.4 0.4 V max ISINK = 1.6 mA DB11–DB0 Floating-State Leakage Current ±10 ±10 ±10 µA max Floating-State Capacitance 4 15 15 15 pF max Output Coding AD7892-1 and AD7892-3 Two’s Complement AD7892-2 Straight (Natural) Binary CONVERSION RATE Conversion Time 1.47 1.47 µs max AD7892-3 Track/Hold Acquisition Time 3 0.2 0.2 µs max AD7892-3 Conversion Time 1.6 1.6 1.68 µs max AD7892-1 and AD7892-2 Track/Hold Acquisition Time 3 0.4 0.4 0.32 µs max AD7892-1 and AD7892-2 POWER REQUIREMENTS VDD +5 +5 +5 V nom ±5% for Specified Performance IDD 5 Normal Operation 18 18 19 mA max Standby Mode 6 AD7892-2 250 250 µA typ AD7892-3, AD7892-1 80 80 100 µA max typ 15 µA Power Dissipation 5 Normal Operation 90 90 95 mW max VDD = +5 V. Typically 60 mW Standby Mode 6 AD7892-2 1.25 1.25 mW typ AD7892-3, AD7892-1 400 400 500 µW max VDD = +5 V. Typically 75 µW NOTES 1Temperature ranges are as follows: A, B Versions: –40 °C to +85°C; S Version: –55°C to +125°C. 2S Version available on AD7892-1 and AD7892-2 only. 3See Terminology. 4Sample tested @ +25 °C to ensure compliance. 5These normal mode and standby mode currents are achieved with resistors (in the range 10 k Ω to 100 kΩ) to either DGND or V DD on Pins 8, 9, 16 and 17. 6A conversion should not be initiated on the part within 30 µs of exiting standby mode. Specifications subject to change without notice. AD7892 Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260 °C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. REV. C –3– |
Numéro de pièce similaire - AD7892BR-3 |
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Description similaire - AD7892BR-3 |
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