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BYC8D-600127 Fiches technique(PDF) 4 Page - NXP Semiconductors |
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BYC8D-600127 Fiches technique(HTML) 4 Page - NXP Semiconductors |
4 / 11 page BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 4 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 3 --2.5 K/W Rth(j-a) thermal resistance from junction to ambient free air in free air - 60 - K/W Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width 001aag913 1 10−1 10 Zth(j-mb) (K/W) 10−3 10−2 tp (s) 10−6 10 1 10−1 10−5 10−3 10−2 10−4 tp tp T P t T δ = |
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