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TLP266J Fiches technique(PDF) 7 Page - Toshiba Semiconductor

No de pièce TLP266J
Description  Triac Drivers Programmable Logic Controllers (PLCs) AC-Output Modules
Download  13 Pages
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Fabricant  TOSHIBA [Toshiba Semiconductor]
Site Internet  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP266J Fiches technique(HTML) 7 Page - Toshiba Semiconductor

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TLP266J
7
12.
12.
12.
12. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
12.1.
12.1.
12.1.
12.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
When using soldering reflow (See Fig. 12.1.1 and 12.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 12.1.1
12.1.1
12.1.1
12.1.1 An Example of a Temperature
An Example of a Temperature
An Example of a Temperature
An Example of a Temperature
Profile When Sn-Pb Eutectic Solder Is Used
Profile When Sn-Pb Eutectic Solder Is Used
Profile When Sn-Pb Eutectic Solder Is Used
Profile When Sn-Pb Eutectic Solder Is Used
Fig.
Fig.
Fig.
Fig. 12.1.2
12.1.2
12.1.2
12.1.2
An Example of a Temperature
An Example of a Temperature
An Example of a Temperature
An Example of a Temperature
Profile When Lead(Pb)-Free Solder Is Used
Profile When Lead(Pb)-Free Solder Is Used
Profile When Lead(Pb)-Free Solder Is Used
Profile When Lead(Pb)-Free Solder Is Used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150  for 60 to 120 seconds.
Mounting condition of 260  within 10 seconds is recommended.
Flow soldering must be performed once.
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not
exceeding 350  Heating by soldering iron must be done only once per lead.
12.2.
12.2.
12.2.
12.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5  to 35  and 45% to 75%,
respectively.
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2012-11-29
Rev.1.0


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