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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SI9410DY Fiches technique(PDF) 2 Page - Fairchild Semiconductor |
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SI9410DY Fiches technique(HTML) 2 Page - Fairchild Semiconductor |
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q Wyhtr WBTÃ2ÃÃWÃDTÃ2Ã!Ã6ÃÃÃÃÃÃÃÃÃIrÃ! & W Notes: 1: RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. Scale 1 : 1 on letter size paper 2: Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% a) 50° C/W when mounted on a 1 in2 pad of 2 oz. copper. b) 105° C/W when mounted on a 0.04 in2 pad of 2 oz. copper. c) 125° C/W on a minimum mounting pad. |
Numéro de pièce similaire - SI9410DY |
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Description similaire - SI9410DY |
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