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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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AMC7812 Fiches technique(PDF) 2 Page - Texas Instruments |
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AMC7812 Fiches technique(HTML) 2 Page - Texas Instruments |
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2 / 92 page  AMC7812 SBAS513E – JANUARY 2011 – REVISED SEPTEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) MAXIMUM MAXIMUM RELATIVE DIFFERENTIAL SPECIFIED ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING QFN-64 RGC –40°C to +105°C AMC7812 AMC7812 ±1 ±1 HTQFP-64 PAP –40°C to +105°C AMC7812 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. AMC7812 UNIT AVDD to GND –0.3 to +6 V DVDD to GND –0.3 to +6 V IOVDD to GND –0.3 to +6 V AVCC to GND –0.3 to +18 V DVDD to DGND –0.3 to +6 V Analog input voltage to GND –0.3 to AVDD + 0.3 V ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND –0.3 to +6 V D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND –0.3 to AVDD + 0.3 V Digital input voltage to DGND –0.3 to IOVDD + 0.3 V SDO and DAV to GND –0.3 to IOVDD + 0.3 V Operating temperature range –40 to +105 °C Storage temperature range –40 to +150 °C Junction temperature range (TJ max) +150 °C Human body model (HBM) 2.5 kV ESD ratings Charged device model (CDM) 1.0 kV (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. THERMAL INFORMATION AMC7812 THERMAL METRIC(1) RGC (QFN) PAP (HTQFP) UNITS 64 PINS 64 PINS θJA Junction-to-ambient thermal resistance 24.1 33.7 θJCtop Junction-to-case (top) thermal resistance 8.1 9.5 θJB Junction-to-board thermal resistance 3.2 9.0 °C/W ψJT Junction-to-top characterization parameter 0.1 0.3 ψJB Junction-to-board characterization parameter 3.3 8.9 θJCbot Junction-to-case (bottom) thermal resistance 0.6 0.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: AMC7812 |
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