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IRF7811A Fiches technique(PDF) 1 Page - International Rectifier

No de pièce IRF7811A
Description  PROVISIONAL DATASHEET
Download  4 Pages
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Fabricant  IRF [International Rectifier]
Site Internet  http://www.irf.com
Logo IRF - International Rectifier

IRF7811A Fiches technique(HTML) 1 Page - International Rectifier

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1
IRF7809A/IRF7811A
Parameter
Symbol
IRF7809A
IRF7811A
Units
Drain-Source Voltage
V
DS
30
28
V
Gate-Source Voltage
V
GS
±12
Continuous Drain or Source
T
A = 25°C
I
D
14.5
11.4
Current (V
GS ≥ 4.5V)
T
L = 90°C
14.2
11.2
A
Pulsed Drain Current

I
DM
100
100
Power Dissipation
T
A = 25°C
P
D
2.5
W
T
L = 90°C
2.4
Junction & Storage Temperature Range
T
J, TSTG
–55 to 150
°C
Continuous Source Current (Body Diode)
I
S
2.5
2.5
A
Pulsed Source Current

I
SM
50
50
• N-Channel Application-Specific MOSFETs
• Ideal for CPU Core DC-DC Converters
• Low Conduction Losses
• Low Switching Losses
• Minimizes Parallel MOSFETs for high current
applications
Description
These new devices employ advanced HEXFET® Power
MOSFET technology to achieve an unprecedented balance
of on-resistance and gate charge.The reduced conduction
and switching losses make them ideal for high efficiency
DC-DC converters that power the latest generation of
microprocessors.
Both the IRF7809A and IRF7811A have been optimized
and are 100% tested for all parameters that are critical in
synchronous buck converters including R
DS(on), gate charge
and Cdv/dt-induced turn-on immunity.The IRF7809A offers
particulary low R
DS(on) and high Cdv/dt immunity for
synchronous FET applications. The IRF7811A offers an
extremely low combination of Q
sw & RDS(on) for reduced
losses in control FET applications.
The package is designed for vapor phase, infra-red,
convection, or wave soldering techniques. Power
dissipation of greater than 2W is possible in a typical PCB
mount application.
HEXFET® Chipset for DC-DC Converters
IRF7809A
IRF7811A
V
DS
30V
28V
R
DS(on)
8.5 m
12 m
Q
G
73 nC
23 nC
Q
sw
22.5 nC
7 nC
Q
oss
30 nC
31 nC
Absolute Maximum Ratings
Parameter
Max.
Units
Maximum Junction-to-Ambient
ƒ
Rθ
JA
50
°C/W
Maximum Junction-to-Lead
Rθ
JL
25
°C/W
Thermal Resistance
DEVICE RATINGS
To p V ie w
8
1
2
3
4
5
6
7
D
D
D
D
G
S
A
S
S
A
IRF7809A/IRF7811A
SO-8
01/19/00
PROVISIONAL DATASHEET
PD - 93810
PD - 93811


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