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TLC5947RHBRG4 Fiches technique(PDF) 2 Page - Texas Instruments |
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TLC5947RHBRG4 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 29 page ABSOLUTE MAXIMUM RATINGS (1) (2) DISSIPATION RATINGS TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TLC5947DAPR Tape and Reel, 2000 TLC5947 HTSSOP-32 PowerPAD™ TLC5947DAP Tube, 46 TLC5947RHBR Tape and Reel, 3000 TLC5947 5-mm × 5-mm QFN-32 TLC5947RHB Tape and Reel, 250 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range, unless otherwise noted. PARAMETER TLC5947 UNIT VCC Supply voltage: VCC –0.3 to +6.0 V IO Output current (dc) OUT0 to OUT23 38 mA VI Input voltage range SIN, SCLK, XLAT, BLANK –0.3 to VCC + 0.3 V SOUT –0.3 to VCC + 0.3 V VO Output voltage range OUT0 to OUT23 –0.3 to +33 V TJ(MAX) Operating junction temperature +150 °C TSTG Storage temperature range –55 to +150 °C Human body model (HBM) 2 kV ESD rating Charged device model (CDM) 500 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) All voltage values are with respect to network ground terminal. OPERATING FACTOR TA < +25°C TA = +70°C TA = +85°C PACKAGE ABOVE TA = +25°C POWER RATING POWER RATING POWER RATING HTSSOP-32 with 42.54 mW/°C 5318 mW 3403 mW 2765 mW PowerPAD soldered(1) HTSSOP-32 with 22.56 mW/°C 2820 mW 1805 mW 1466 mW PowerPAD not soldered(2) QFN-32(3) 27.86 mW/°C 3482 mW 2228 mW 1811 mW (1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available for download at www.ti.com). (2) With PowerPAD not soldered onto copper area on PCB. (3) The package thermal impedance is calculated in accordance with JESD51-5. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 |
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