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TLC5947RHBRG4 Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce TLC5947RHBRG4
Description  24-Channel, 12-Bit PWM LED Driver with Internal Oscillator
Download  29 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

TLC5947RHBRG4 Fiches technique(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1) (2)
DISSIPATION RATINGS
TLC5947
SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
ORDERING NUMBER
TRANSPORT MEDIA, QUANTITY
TLC5947DAPR
Tape and Reel, 2000
TLC5947
HTSSOP-32 PowerPAD™
TLC5947DAP
Tube, 46
TLC5947RHBR
Tape and Reel, 3000
TLC5947
5-mm × 5-mm QFN-32
TLC5947RHB
Tape and Reel, 250
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
TLC5947
UNIT
VCC
Supply voltage: VCC
–0.3 to +6.0
V
IO
Output current (dc)
OUT0 to OUT23
38
mA
VI
Input voltage range
SIN, SCLK, XLAT, BLANK
–0.3 to VCC + 0.3
V
SOUT
–0.3 to VCC + 0.3
V
VO
Output voltage range
OUT0 to OUT23
–0.3 to +33
V
TJ(MAX)
Operating junction temperature
+150
°C
TSTG
Storage temperature range
–55 to +150
°C
Human body model (HBM)
2
kV
ESD rating
Charged device model (CDM)
500
V
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2)
All voltage values are with respect to network ground terminal.
OPERATING FACTOR
TA < +25°C
TA = +70°C
TA = +85°C
PACKAGE
ABOVE TA = +25°C
POWER RATING
POWER RATING
POWER RATING
HTSSOP-32 with
42.54 mW/°C
5318 mW
3403 mW
2765 mW
PowerPAD soldered(1)
HTSSOP-32 with
22.56 mW/°C
2820 mW
1805 mW
1466 mW
PowerPAD not soldered(2)
QFN-32(3)
27.86 mW/°C
3482 mW
2228 mW
1811 mW
(1)
With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2)
With PowerPAD not soldered onto copper area on PCB.
(3)
The package thermal impedance is calculated in accordance with JESD51-5.
2
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TLC5947


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