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TDZ5V1J Fiches technique(PDF) 3 Page - NXP Semiconductors

No de pièce TDZ5V1J
Description  Single Zener diodes
Download  12 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDZ5V1J Fiches technique(HTML) 3 Page - NXP Semiconductors

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TDZXJ_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 July 2011
3 of 12
NXP Semiconductors
TDZxJ series
Single Zener diodes
5.
Limiting values
[1]
tp =100 s; square wave; Tj =25 C before surge.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 16 mm2.
[2]
Soldering point of cathode tab.
7.
Characteristics
[1]
Pulse test: tp  300 s;  0.02.
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
IF
forward current
-
250
mA
IZSM
non-repetitive peak
reverse current
[1] -see
Table 8
and 10
PZSM
non-repetitive peak
reverse power dissipation
[1]
TDZ2V4J to TDZ5V6J
-
180
W
TDZ6V2J to TDZ6V8J
-
100
W
TDZ7V5J to TDZ30J
-
40
W
Ptot
total power dissipation
Tamb  25 C
[2] -500
mW
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1] --250
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[2] --25
K/W
Table 7.
Characteristics
Tj =25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
[1]
IF =10mA
-
-
0.9
V
IF =100 mA
-
-
1.1
V


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