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HCPL-6430 Fiches technique(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-6430 Fiches technique(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
2 / 12 page 2 Selection Guide–Package Styles and Lead Configuration Options Package 8 Pin DIP 8 Pin DIP 20 Pad LCCC Lead Style Through Hole Through Hole Surface Mount Channels 1 2 2 Common Channel Wiring None VCC, GND None Avago Part # & Options Commercial HCPL-5400 HCPL-5430 HCPL-6430 MIL-PRF-38534, Class H HCPL-5401 HCPL-5431 HCPL-6431 MIL-PRF-38534, Class K HCPL-540K HCPL-543K HCPL-643K Standard Lead Finish Gold Plate Gold Plate Solder Pads* Solder Dipped* Option 200 Option 200 Butt Cut/Gold Plate Option 100 Option 100 Gull Wing/Soldered* Option 300 Option 300 Class H SMD Part # Prescript for all below 5962- 5962- 5962- Gold Plate 8957001PC 8957101PC Solder Dipped* 8957001PA 8957101PA 89571022A Butt Cut/Gold Plate 8957001YC 8957101YC Butt Cut/Soldered* 8957001YA 8957101YA Gull Wing/Soldered* 8957001XA 8957101XA Class K SMD Part # Prescript for all below 5962- 5962- 5962- Gold Plate 8957002KPC 8957103KPC Solder Dipped* 8957002KPA 8957103KPA 8957104K2A Butt Cut/Gold Plate 8957002KYC 8957103KYC Butt Cut/Soldered* 8957002KYA 8957103KYA Gull Wing/Soldered* 8957002KXA 8957103KXA *Solder contains lead. Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. This combination results in very high data rate capability. The detector has a threshold with hysteresis, which typically provides 0.25 mA of differen- tial mode noise immunity and minimizes the potential for output signal chatter. The detector in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus. All units are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion speci- fication guarantees a 10 MBd signaling rate at +125° C with 35% pulse width distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for these parts are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and per- formance characteristics shown in the figures are similar for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results. |
Numéro de pièce similaire - HCPL-6430 |
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Description similaire - HCPL-6430 |
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