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TPS2206IDAPRG4 Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS2206IDAPRG4 Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 33 page TPS2206 DUALSLOT PC CARD POWERINTERFACE SWITCH WITH RESET FOR SERIAL PCMCIA CONTROLLER SLVS138D − MAY 1996 − REVISED JANUARY 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS2206Y chip information This chip, when properly assembled, displays characteristics similar to those of the TPS2206. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 142 144 43 2 1 23 22 21 20 19 18 17 16 14 15 13 12 11 10 9 8 7 6 5 TPS2206Y 5V 5V DATA CLOCK LATCH RESET 12V AVPP AVCC AVCC AVCC GND 5V 12V BVPP BVCC BVCC BVCC 1 2 3 4 5 6 7 8 9 10 11 12 23 22 21 20 19 18 17 16 15 14 13 OC 3.3V 3.3V 3.3V RESET |
Numéro de pièce similaire - TPS2206IDAPRG4 |
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Description similaire - TPS2206IDAPRG4 |
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