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UC2874DW-2 Fiches technique(PDF) 10 Page - Texas Instruments

No de pièce UC2874DW-2
Description  High Efficiency, Synchronous, Step-down (Buck) Controllers
Download  12 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

UC2874DW-2 Fiches technique(HTML) 10 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UC2874DW-1
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2874DW-1G4
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2874DW-2
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2874DW-2G4
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2874N-1
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2874N-1G4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2874N-2
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2874N-2G4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2874Q-1
NRND
PLCC
FN
20
TBD
Call TI
Call TI
UC2874Q-2
NRND
PLCC
FN
20
TBD
Call TI
Call TI
UC3874DW-1
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3874DW-1G4
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3874DW-2
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3874DW-2G4
ACTIVE
SOIC
DW
18
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3874N-1
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3874N-1G4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3874N-2
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3874N-2G4
ACTIVE
PDIP
N
18
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2009
Addendum-Page 1


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