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TLC5947RHBTG4 Fiches technique(PDF) 6 Page - Texas Instruments |
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TLC5947RHBTG4 Fiches technique(HTML) 6 Page - Texas Instruments |
6 / 29 page DEVICE INFORMATION Thermal Pad (BottomSide) SIN 32 OUT8 SCLK OUT9 BLANK OUT10 GND OUT11 VCC OUT12 IREF OUT13 XLAT OUT14 SOUT OUT15 9 10 31 11 30 12 29 13 28 14 27 15 26 16 25 GND BLANK SCLK SIN OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 OUT8 OUT9 15 16 OUT10 OUT11 VCC IREF XLAT SOUT OUT23 OUT22 OUT21 OUT20 OUT19 OUT18 OUT17 OUT16 OUT15 OUT14 28 27 26 25 24 23 22 21 20 19 18 17 OUT13 OUT12 32 31 30 29 ThermalPad (BottomSide) TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com HTSSOP-32 5-mm × 5-mm QFN-32(1) DAP PACKAGE RHB PACKAGE (TOP VIEW) (TOP VIEW) (1) This device is product preview. NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern. 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 |
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