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TPS2813PWR Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS2813PWR Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 38 page TPS2811, TPS2812, TPS2813, TPS2814, TPS2815 DUAL HIGHSPEED MOSFET DRIVERS SLVS132F − NOVEMBER 1995 − REVISED OCTOBER 2004 3 www.ti.com TPS28xxY chip information This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform. 57 BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax OPERATING TEMPERATURE = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. (7) (6) (1) (5) (2) (3) GND 1OUT VCC REG_IN 1IN TPS2811Y TPS2812Y TPS2813Y REG_OUT (8) (4) 2IN 47 (1) (8) (7) (2) (3) (4) (5) (6) 2OUT (6) (5) (1) (4) (2) (8) GND 1OUT VCC 1IN1 1IN2 TPS2814Y (7) (3) 2IN1 2OUT 2IN2 (6) (5) (1) (4) (2) (8) GND 1OUT VCC 1IN1 1IN2 TPS2815Y (7) (3) 2IN1 2OUT 2IN2 |
Numéro de pièce similaire - TPS2813PWR |
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Description similaire - TPS2813PWR |
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