STF202−22T1G

http://onsemi.com

6

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE V

STYLE 8:

PIN 1. Vbus

2. D(in)-

3. D(in)+

4. D(out)+

5. D(out)-

6. GND

23

4

5

6

D

1

e

b

E1

A1

A

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

c

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MILLIMETERS

0.90

1.00

1.10

A1

0.01

0.06

0.10

b

0.25

0.38

0.50

c

0.10

0.18

0.26

D

2.90

3.00

3.10

E

2.50

2.75

3.00

e

0.85

0.95

1.05

L

0.20

0.40

0.60

0.25 BSC

L2

−

0

°

10°

1.30

1.50

1.70

E1

E

RECOMMENDED

NOTE 5

L

C

M

H

L2

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

DETAIL Z

0.60

6X

3.20

0.95

6X

0.95

PITCH

DIMENSIONS: MILLIMETERS

M

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particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

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STF202−22T1/D

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