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UC2872N Fiches technique(PDF) 7 Page - Texas Instruments

No de pièce UC2872N
Description  Resonant Lamp Ballast Controller
Download  11 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

UC2872N Fiches technique(HTML) 7 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UC2872DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2872DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2872DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2872DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2872N
ACTIVE
PDIP
N
14
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2872NG4
ACTIVE
PDIP
N
14
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2872Q
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2872QG3
ACTIVE
PLCC
FN
20
46
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC3872DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872M
ACTIVE
SSOP/
QSOP
DBQ
16
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872MG4
ACTIVE
SSOP/
QSOP
DBQ
16
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872MTR
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872MTRG4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3872N
ACTIVE
PDIP
N
14
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3872NG4
ACTIVE
PDIP
N
14
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2009
Addendum-Page 1


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