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TMP36GT9Z Fiches technique(PDF) 4 Page - Analog Devices |
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TMP36GT9Z Fiches technique(HTML) 4 Page - Analog Devices |
4 / 20 page TMP35/TMP36/TMP37 Rev. F | Page 4 of 20 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter1, 2 Rating Supply Voltage 7 V Shutdown Pin GND ≤ SHUTDOWN ≤ +VS Output Pin GND ≤ VOUT ≤ +VS Operating Temperature Range −55°C to +150°C Die Junction Temperature 175°C Storage Temperature Range −65°C to +160°C IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature Range 10 sec to 20 sec Ramp-Up Rate 3°C/sec Ramp-Down Rate −6°C/sec Time 25°C to Peak Temperature 6 min IR Reflow Soldering—Pb-Free Package Peak Temperature 260°C (0°C) Time at Peak Temperature Range 20 sec to 40 sec Ramp-Up Rate 3°C/sec Ramp-Down Rate −6°C/sec Time 25°C to Peak Temperature 8 min 1 Digital inputs are protected; however, permanent damage can occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 2 Remove power before inserting or removing units from their sockets. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device in socket. Table 3. Thermal Resistance Package Type θJA θJC Unit TO-92 (T-3) 162 120 °C/W SOIC_N (R-8) 158 43 °C/W SOT-23 (RJ-5) 300 180 °C/W ESD CAUTION |
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