Moteur de recherche de fiches techniques de composants électroniques
Selected language     French  ▼
Nom de la pièce
         Description


EVAL-AD7607EDZ Datasheet(Fiches technique) 29 Page - Analog Devices

Numéro de pièce EVAL-AD7607EDZ
Description  8-Channel DAS with 14-Bit, Bipolar Input, Simultaneous Sampling ADC
Télécharger  32 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo 

 
 29 page
background image
Data Sheet
AD7607
Rev. B | Page 29 of 32
LAYOUT GUIDELINES
The printed circuit board that houses the AD7607 should be
designed so that the analog and digital sections are separated
and confined to different areas of the board.
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the case of the
split plane, the digital and analog ground planes should be joined
in only one place, preferably as close as possible to the AD7607.
If the AD7607 is in a system where multiple devices require
analog-to-digital ground connections, the connection should
still be made at only one point: a star ground point that should be
established as close as possible to the AD7607. Good connections
should be made to the ground plane. Avoid sharing one connection
for multiple ground pins. Use individual vias or multiple vias to
the ground plane for each ground pin.
Avoid running digital lines under the devices because doing so
couples noise onto the die. The analog ground plane should be
allowed to run under the AD7607 to avoid noise coupling. Fast
switching signals like CONVST A, CONVST B, or clocks should
be shielded with digital ground to avoid radiating noise to other
sections of the board, and they should never run near analog
signal paths. Avoid crossover of digital and analog signals. Traces
on layers in close proximity on the board should run at right angles
to each other to reduce the effect of feedthrough through the board.
The power supply lines to the AVCC and VDRIVE pins should use
as large a trace as possible to provide low impedance paths and
reduce the effect of glitches on the power supply lines. Where
possible, use supply planes and make good connections between
the AD7607 supply pins and the power tracks on the board.
Use a single via or multiple vias for each supply pin.
Good decoupling is also important in lowering the supply
impedance presented to the AD7607 and in reducing the
magnitude of the supply spikes. The decoupling capacitors should
be placed close to (ideally, right up against) these pins and their
corresponding ground pins. Place the decoupling capacitors for
the REFIN/REFOUT pin and the REFCAPA and REFCAPB
pins as close as possible to their respective AD7607 pins; and,
where possible, they should be placed on the same side of the
board as the AD7607 device.
Figure 52 shows the recommended decoupling on the top layer
of the AD7607 board. Figure 53 shows bottom layer decoupling,
which is used for the four AVCC pins and the VDRIVE pin.
Figure 52. Top Layer Decoupling REFIN/REFOUT,
REFCAPA, REFCAPB, and REGCAP Pins
Figure 53. Bottom Layer Decoupling




Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32 


Datasheet Download




Lien URL

AllDATASHEET vous a-t-il été utile ?   [ DONATE ]  

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Favoris   |   Echange de liens   |   Fabricants
All Rights Reserved © Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl