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AD6650 Fiches technique(PDF) 10 Page - Analog Devices |
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AD6650 Fiches technique(HTML) 10 Page - Analog Devices |
10 / 44 page AD6650 Rev. A | Page 10 of 44 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating Supply Voltage −0.3 V to +3.6 V Input Voltage −0.3 V to +3.6 V Output Voltage Swing −0.3 V to VDDIO + 0.3 V Load Capacitance 200 pF Junction Temperature Under Bias 125°C Storage Temperature Range −65°C to +150°C Lead Temperature (5 sec) 280°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS 121-lead chip scale package ball grid array: θJA = 22.8°C/W, no airflow, measurements made in the horizontal position on a 4-layer board. θJA = 20.2°C/W, 200 LFPM airflow, measurements made in the horizontal position on a 4-layer board. θJA = 20.7°C/W, no airflow, soldered on an 8-layer board with two layers dedicated as ground planes. ESD CAUTION |
Numéro de pièce similaire - AD6650_07 |
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Description similaire - AD6650_07 |
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