TC1413/TC1413N

DS21392D-page 12

 2001-2012 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

D

A

A1

L

c

(F )

A2

E1

E

p

B

n

1

2

Dimens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not

.037 R E F

F

F ootprint (R eference)

exceed .010" (0.254mm) per s ide.

Notes :

Drawing No. C 04-111

*C ontrolling P arameter

Mold Draft Angle T op

Mold Draft Angle B ottom

F oot Angle

Lead Width

Lead T hicknes s

c

B

.003

.009

.006

.012

Dimens ion Limits

Overall Height

Molded P ackage T hicknes s

Molded P ackage Width

Overall Length

F oot Length

Standoff

Overall Width

Number of P ins

Pitch

A

L

E1

D

A1

E

A2

.016

.024

.118 B S C

.118 B S C

.000

.030

.193 B S C

.033

MIN

p

n

Units

.026 B S C

NOM

8

INC HE S

0.95 R E F

-

-

.009

.016

0.08

0.22

0˚

0.23

0.40

8˚

MILLIME T E R S *

0.65 B S C

0.85

3.00 B S C

3.00 B S C

0.60

4.90 B S C

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

8

--

-

15˚

5˚

-

15˚

5˚

-

J E DE C E quivalent: MO-187

0˚

-

8˚

5˚

5˚

-

-

15˚

15˚

-

-

-

-

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging