TC1263

DS21374D-page 12

 2002-2012 Microchip Technology Inc.

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)

Foot Angle



04

80

48

15

12

0

15

12

0



Mold Draft Angle Bottom

15

12

0

15

12

0



Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

B

Lead Width

0.25

0.23

0.20

.010

.009

.008

c

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

L

Foot Length

0.51

0.38

0.25

.020

.015

.010

h

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

D

Overall Length

3.99

3.91

3.71

.157

.154

.146

E1

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

E

Overall Width

0.25

0.18

0.10

.010

.007

.004

A1

Standoff

§

1.55

1.42

1.32

.061

.056

.052

A2

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

A

Overall Height

1.27

.050

p

Pitch

8

8

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2

1

D

n

p

B

E

E1

h

L



c

45





A2



A

A1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging