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SST89V516RD Fiches technique(PDF) 73 Page - Microchip Technology |
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SST89V516RD Fiches technique(HTML) 73 Page - Microchip Technology |
73 / 94 page ©2013 Silicon Storage Technology, Inc. DS25093B 02/13 73 FlashFlex MCU SST89E516RD2 / SST89E516RD SST89V516RD2 / SST89V516RD Data Sheet Electrical Specification Note: This specification contains preliminary information on new products in production. The specifications are subject to change without notice. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con- ditions may affect device reliability.) Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (<20ns) on Any Other Pin to VSS. . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V Maximum IOL per I/O Pins P1.5, P1.6, P1.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W Through Hole Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300°C Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds 1. Excluding certain with-Pb 32-PLCC units, all packages are 260 °C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240 °C for 10 seconds; please consult the factory for the latest information. Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 2. Outputs shorted for no more than one second. No more than one output shorted at a time. (Based on package heat transfer limitations, not device power consumption. Table 31: Operating Range Symbol Description Min. Max Unit TA Ambient Temperature Under Bias Standard 0 +70 °C Industrial -40 +85 °C VDD Supply Voltage SST89E516RDx 4.5 5.5 V SST89V516RDx 2.7 3.6 V fOSC Oscillator Frequency SST89E516RDx 0 40 MHz SST89V516RDx 0 33 MHz Oscillator Frequency for IAP SST89E516RDx .25 40 MHz SST89V516RDx .25 33 MHz T0-0.0 25093 |
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