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UC2879DWTRG4 Fiches technique(PDF) 2 Page - Texas Instruments

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No de pièce UC2879DWTRG4
Description  PHASE SHIFT RESONANT CONTROLLER
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

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DESCRIPTION (CONTINUED)
ABSOLUTE MAXIMUM RATINGS
(1)
THERMAL CHARACTERISTICS
UC1879
UC2879
UC3879
SLUS230B – JUNE 1998 – REVISED JUNE 2007
With the oscillator capable of operating in excess of 600 kHz, overall output switching frequencies to 300 kHz
are practical. In addition to the standard free running mode, with the CLKSYNC pin, the user may configure the
UC3879 to accept an external clock synchronization signal. Alternatively, up to three units can be locked
together with the operational frequency determined by the fastest device.
Protective features include an undervoltage lockout and overcurrent protection. Additional features include a
10-MHz error amplifier, a 5-V precision reference, and soft start. The UC3879 is available in 20 pin N, J, DW,
and Q and 28 pin L packages.
PARAMETER
VALUE
UNIT
Supply voltage (VC, VIN)
20
V
Output current, source or sink, dc
20
mA
Output current, source, sink peak for 0.1
µs at max frequency of 300
100
kHz
Analog inputs
(Pins 1, 2, 3, 4, 5, 6, 14, 15, 17, 18, 19)
–0.3 to 5.3
V
(Pin 16)
–0.03 to VIN
Analog outputs
(Pins 7, 8, 12, 13)
–0.3 to VC to 0.3
V
Storage temperature range
–65
°C to 150°C
Junction temperature
–55
°C to 150°C
°C
Lead temperature (soldering, 10 sec)
300°C
(1)
Pin references are to 20-pin DIL and SOIC packages. All voltages are with respect to ground unless otherwise stated. Currents are
positive into, negative out of the specified terminal.
over operating free-air temperature range (unless otherwise noted)
PACKAGE
θ
JA
θ
JC
J-20
70-85
28(1)
N-20
80(2)
35
DW-20 SOIC
45-95(2)
25
PLCC-20
43-75(2)
34
CLCC-20
N/A
5-8(2)(3)
(1)
θ
JC data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states "The baseline values shown are worst case (mean
+2s) for a 60 x 60 mil microcircuit device silicon die and aplicable for devices with die sizes up to 14400 square mils. For devices die
sizes greater than 14400 square mils use the following values; dual-in-line, 11
°C/W; flat pacl 10°C/W; pin grid array, 10°C/W".
(2)
Specified
θ
JA (junction-to-ambient) is for devices mounted to 5-in
2 FR4 PC board with one ounce copper wire where noted. When
resistance range is given, lower values are for 5-in2 aluminum PC board. Test PWB was 0.062 in thick and typically used 0.635-mm
trace widths for power packages and 1.3-mm trace widths for non-power packages with a 100 x 100 mil probe land area at the end of
each trace.
(3)
θ
JC estimated for backside of device, through the metalized thermal conduction pads.
2
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