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UC2879DW Fiches technique(PDF) 2 Page - Texas Instruments |
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UC2879DW Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 15 page www.ti.com DESCRIPTION (CONTINUED) ABSOLUTE MAXIMUM RATINGS (1) THERMAL CHARACTERISTICS UC1879 UC2879 UC3879 SLUS230B – JUNE 1998 – REVISED JUNE 2007 With the oscillator capable of operating in excess of 600 kHz, overall output switching frequencies to 300 kHz are practical. In addition to the standard free running mode, with the CLKSYNC pin, the user may configure the UC3879 to accept an external clock synchronization signal. Alternatively, up to three units can be locked together with the operational frequency determined by the fastest device. Protective features include an undervoltage lockout and overcurrent protection. Additional features include a 10-MHz error amplifier, a 5-V precision reference, and soft start. The UC3879 is available in 20 pin N, J, DW, and Q and 28 pin L packages. PARAMETER VALUE UNIT Supply voltage (VC, VIN) 20 V Output current, source or sink, dc 20 mA Output current, source, sink peak for 0.1 µs at max frequency of 300 100 kHz Analog inputs (Pins 1, 2, 3, 4, 5, 6, 14, 15, 17, 18, 19) –0.3 to 5.3 V (Pin 16) –0.03 to VIN Analog outputs (Pins 7, 8, 12, 13) –0.3 to VC to 0.3 V Storage temperature range –65 °C to 150°C Junction temperature –55 °C to 150°C °C Lead temperature (soldering, 10 sec) 300°C (1) Pin references are to 20-pin DIL and SOIC packages. All voltages are with respect to ground unless otherwise stated. Currents are positive into, negative out of the specified terminal. over operating free-air temperature range (unless otherwise noted) PACKAGE θ JA θ JC J-20 70-85 28(1) N-20 80(2) 35 DW-20 SOIC 45-95(2) 25 PLCC-20 43-75(2) 34 CLCC-20 N/A 5-8(2)(3) (1) θ JC data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states "The baseline values shown are worst case (mean +2s) for a 60 x 60 mil microcircuit device silicon die and aplicable for devices with die sizes up to 14400 square mils. For devices die sizes greater than 14400 square mils use the following values; dual-in-line, 11 °C/W; flat pacl 10°C/W; pin grid array, 10°C/W". (2) Specified θ JA (junction-to-ambient) is for devices mounted to 5-in 2 FR4 PC board with one ounce copper wire where noted. When resistance range is given, lower values are for 5-in2 aluminum PC board. Test PWB was 0.062 in thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace widths for non-power packages with a 100 x 100 mil probe land area at the end of each trace. (3) θ JC estimated for backside of device, through the metalized thermal conduction pads. 2 Submit Documentation Feedback |
Numéro de pièce similaire - UC2879DW |
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Description similaire - UC2879DW |
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