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74LCX16374MEA Fiches technique(PDF) 1 Page - Fairchild Semiconductor |
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74LCX16374MEA Fiches technique(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page © 2005 Fairchild Semiconductor Corporation DS012003 www.fairchildsemi.com February 1994 Revised May 2005 74LCX16374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs General Description The LCX16374 contains sixteen non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus ori- ented applications. The device is byte controlled. A buff- ered clock (CP) and Output Enable (OE) are common to each byte and can be shorted together for full 16-bit opera- tion. The LCX16374 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The LCX16374 is fabricated with an advanced CMOS tech- nology to achieve high speed operation while maintaining CMOS low power dissipation. Features s 5V tolerant inputs and outputs s 2.3V–3.6V VCC specifications provided s 6.2 ns tPD max (VCC 3.3V), 20 PA ICC max s Power down high impedance inputs and outputs s Supports live insertion/withdrawal (Note 1) s r24 mA output drive (VCC 3.0V) s Uses patented noise/EMI reduction circuitry s Latch-up performance exceeds 500 mA s ESD performance: Human body model ! 2000V Machine model ! 200V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Note 1: To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Note 2: Ordering code “G” indicates Trays. Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol Order Number Package Number Package Description 74LCX16374G (Note 2)(Note 3) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LCX16374MEA (Note 3) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LCX16374MTD (Note 3) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
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