AD9617

–10–

REV. B

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Small Outline Package

(SO-8)

85

4

1

0.198 (5.00)

0.188 (4.74)

0.244 (6.200)

0.228 (5.80)

PIN 1

0.158 (4.00)

0.150 (3.80)

0.050 (1.27)

BSC

0.069 (1.75)

0.053 (1.35)

SEATING

PLANE

0.010 (0.25)

0.004 (0.10)

0.018 (0.46)

0.014 (0.36)

0.015 (0.38)

0.007 (0.18)

0.045 (1.15)

0.020 (0.50)

8

0

0.205 (5.20)

0.181 (4.60)

Plastic DIP

(N-8)

SEATING

PLANE

0.060 (1.52)

0.015 (0.38)

0.210

(5.33)

MAX

0.022 (0.558)

0.014 (0.356)

0.200 (5.05)

0.125 (3.18)

0.070 (1.77)

0.045 (1.15)

0.150

(3.81)

MIN

8

14

5

PIN 1

0.280 (7.11)

0.240 (6.10)

0.100 (2.54)

BSC

0.430 (10.92)

0.348 (8.84)

0.015 (0.381)

0.008 (0.204)

0.325 (8.25)

0.300 (7.62)

0 –15

LAYOUT CONSIDERATIONS

As with all high performance amplifiers, printed circuit layout is

critical in obtaining optimum results with the AD9617. The

ground plane in the area of the amplifier should cover as much

of the component side of the board as possible. Each power

supply trace should be decoupled close to the package with at

least a 3.3

µF tantalum and a low inductance, 0.1 µF ceramic

capacitor.

All lead lengths for input, output and the feedback resistor

should be kept as short as possible. All gain setting resistors

should be chosen for low values of parasitic capacitance and

inductance, i.e., microwave resistors and/or carbon resistors.

Stripline techniques should be used for lead lengths in excess of

one inch. Sockets should be avoided if possible because of their

stray inductance and capacitance.