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AD8552ARU Fiches technique(PDF) 4 Page - Analog Devices |
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AD8552ARU Fiches technique(HTML) 4 Page - Analog Devices |
4 / 20 page AD8551/AD8552/AD8554 –4– REV. 0 ORDERING GUIDE Temperature Package Package Model Range Description Option Brand1 AD8551ARM2 –40 °C to +125°C 8-Lead MSOP RM-8 AHA AD8551AR –40 °C to +125°C 8-Lead SOIC SO-8 AD8552ARU3 –40 °C to +125°C 8-Lead TSSOP RU-8 AD8552AR –40 °C to +125°C 8-Lead SOIC SO-8 AD8554ARU3 –40 °C to +125°C 14-Lead TSSOP RU-14 AD8554AR –40 °C to +125°C 14-Lead SOIC SO-14 NOTES 1Due to package size limitations, these characters represent the part number. 2Available in reels only. 1,000 or 2,500 pieces per reel. 3Available in reels only. 2,500 pieces per reel. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . GND to VS + 0.3 V Differential Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . ±5.0 V ESD(Human Body Model) . . . . . . . . . . . . . . . . . . . . . 2,000 V Output Short-Circuit Duration to GND . . . . . . . . . Indefinite Storage Temperature Range RM, RU and R Packages . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range AD8551A/AD8552A/AD8554A . . . . . . . . –40 °C to +125°C Junction Temperature Range RM, RU and R Packages . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi- tions for extended periods may affect device reliability. 2Differential input voltage is limited to ±5.0 V or the supply voltage, whichever is less. Package Type JA 1 JC Units 8-Lead MSOP (RM) 190 44 °C/W 8-Lead TSSOP (RU) 240 43 °C/W 8-Lead SOIC (R) 158 43 °C/W 14-Lead TSSOP (RU) 180 36 °C/W 14-Lead SOIC (R) 120 36 °C/W NOTE 1 θ JA is specified for worst case conditions, i.e., θJA is specified for device in socket for P-DIP packages, θ JA is specified for device soldered in circuit board for SOIC and TSSOP packages. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8551/AD8552/AD8554 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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