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AD5302 Fiches technique(PDF) 4 Page - Analog Devices

No de pièce AD5302
Description  2.5 V to 5.5 V, 115 uA, Parallel Interface Single Voltage-Output 8-/10-/12-Bit DACs
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD5302 Fiches technique(HTML) 4 Page - Analog Devices

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REV. 0
AD5330/AD5331/AD5340/AD5341
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5330/AD5331/AD5340/AD5341 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V
VOUT to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range
. . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
TSSOP Package
Power Dissipation . . . . . . . . . . . . . . . (TJ max – TA)/
θ
JA mW
θJA Thermal Impedance (20-Lead TSSOP) . . . . . 143°C/W
θJA Thermal Impedance (24-Lead TSSOP) . . . . . 128°C/W
θ
JA Thermal Impedance (20-Lead TSSOP) . . . . . .
45
°C/W
θJC Thermal Impedance (24-Lead TSSOP) . . . . . . 42°C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . 220 +5/–0
°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Package
Model
Temperature Range
Package Description
Option
AD5330BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-20
AD5331BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-20
AD5340BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-24
AD5341BRU
–40
°C to +105°C
TSSOP (Thin Shrink Small Outline Package)
RU-20


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