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AD5320 Datasheet(Fiches technique) 3 Page - Analog Devices

Numéro de pièce AD5320
Description  2.7 V to 5.5 V, 140 uA, Rail-to-Rail Output 12-Bit DAC in a SOT-23
Télécharger  12 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
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AD5320
–3–
REV. B
TIMING CHARACTERISTICS1, 2
Limit at TMIN, TMAX
Parameter
VDD = 2.7 V to 3.6 V
VDD = 3.6 V to 5.5 V
Unit
Conditions/Comments
t1
3
50
33
ns min
SCLK Cycle Time
t2
13
13
ns min
SCLK High Time
t3
22.5
13
ns min
SCLK Low Time
t4
0
0
ns min
SYNC to SCLK Rising Edge Setup Time
t5
5
5
ns min
Data Setup Time
t6
4.5
4.5
ns min
Data Hold Time
t7
0
0
ns min
SCLK Falling Edge to
SYNC Rising Edge
t8
50
33
ns min
Minimum
SYNC High Time
NOTES
1All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD) and timed from a voltage level of (VIL + VIH)/2.
2See Figure 1.
3Maximum SCLK frequency is 30 MHz at V
DD = +3.6 V to +5.5 V and 20 MHz at VDD = +2.7 V to +3.6 V.
Specifications subject to change without notice.
SCLK
SYNC
DIN
t1
t2
t3
t5
t6
t7
t8
t4
DB15
DB0
Figure 1. Serial Write Operation
(VDD = +2.7 V to +5.5 V; all specifications TMIN to TMAX unless otherwise noted)
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
VOUT to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . +150
°C
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ Max–TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 240
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
µSOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ Max–TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 206
°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature
Branding
Package
Model
Range
Information Options*
AD5320BRT
–40
°C to +105°C
D4B
RT-6
AD5320BRM
–40
°C to +105°C
D4B
RM-8
*RT = SOT-23; RM =
µSOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5320 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE




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