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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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RT7247A Fiches technique(PDF) 13 Page - Richtek Technology Corporation |
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RT7247A Fiches technique(HTML) 13 Page - Richtek Technology Corporation |
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13 / 15 page  RT7247A 13 DS7247A-01 September 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. PD(MAX) = (125 °C − 25°C) / (75°C/W) = 1.333W (min.copper area PCB layout) PD(MAX) = (125 °C − 25°C) / (49°C/W) = 2.04W (70mm2copper area PCB layout) The thermal resistance θJA of SOP-8 (Exposed Pad) is determined by the package architecture design and the PCB layout design. However, the package architecture design has been designed. If possible, it's useful to increase thermal performance by the PCB layout copper design. The thermal resistance θJA can be decreased by adding copper area under the exposed pad of SOP-8 (Exposed Pad) package. As shown in Figure 8, the amount of copper area to which the SOP-8 (Exposed Pad) is mounted affects thermal performance. When mounted to the standard SOP-8 (Exposed Pad) pad (Figure 8.a), θJA is 75°C/W. Adding copper area of pad under the SOP-8 (Exposed Pad) (Figure 8.b) reduces the θJA to 64°C/W. Even further, increasing the copper area of pad to 70mm2 (Figure 8.e) reduces the θJA to 49°C/W. The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. The Figure 9 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. Figure 9. Derating Curve of Maximum Power Dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 Ambient Temperature (°C) Copper Area 70mm 2 50mm 2 30mm 2 10mm 2 Min.Layout Four-Layer PCB (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm 2 , θJA = 54°C/W (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm2 , θJA = 49°C/W Figure 8. Thermal Resistance vs. Copper Area Layout Design |
Numéro de pièce similaire - RT7247A |
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Description similaire - RT7247A |
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