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FAN5904 Fiches technique(PDF) 2 Page - Fairchild Semiconductor |
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FAN5904 Fiches technique(HTML) 2 Page - Fairchild Semiconductor |
2 / 3 page © 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5904 • Rev. 3.0.5 22 Physical Dimensions Product D E X Y Unit FAN5904UC00X 1.710 ±0.030 1.710 ±0.030 0.255 0.255 mm FAN5904UC01X 1.710 ±0.030 1.710 ±0.030 0.255 0.255 mm Figure 60. 1.71x1.71mm Square, 16 Bumps, 0.4mm Pitch, WLCSP Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ BOTTOM VIEW SIDE VIEWS TOP VIEW RECOMMENDED LAND PATTERN BALL A1 INDEX AREA 1 2 3 4 A B C D SEATING PLANE 16X A1 0.005 CA B F (NSMD PAD TYPE) Ø0.260±0.02 0.40 0.40 (X) ±0.018 (Y) ±0.018 0.625 0.547 0.06 C 0.05 C E D F 0.378±0.018 0.208±0.021 NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC016AArev2. 0.03 C 2X 0.03 C 2X E D B C A 0.40 0.40 (Ø0.20) Cu Pad (Ø0.30) Solder Mask Opening |
Numéro de pièce similaire - FAN5904 |
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Description similaire - FAN5904 |
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