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74LVTH374WM Fiches technique(PDF) 1 Page - Fairchild Semiconductor

No de pièce 74LVTH374WM
Description  Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

74LVTH374WM Fiches technique(HTML) 1 Page - Fairchild Semiconductor

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©1999 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LVT374, 74LVTH374 Rev. 1.5.0
January 2008
74LVT374, 74LVTH374
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Features
Input and output interface capability to systems at
5V VCC
Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32mA/+64mA
Functionally compatible with the 74 series 374
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model
> 2000V
– Machine model
> 200V
– Charged-device model
> 1000V
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flops featuring separate D-type inputs
for each flip-flop and 3-STATE outputs for bus-oriented
applications. A buffered Clock (CP) and Output Enable
(OE) are common to all flip-flops.
The LVTH374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT374 and
LVTH374 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LVT374WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT374SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT374MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH374WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH374SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide


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