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ST1284 Fiches technique(PDF) 8 Page - STMicroelectronics |
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ST1284 Fiches technique(HTML) 8 Page - STMicroelectronics |
8 / 10 page Package information ST1284 8/10 Doc ID 6976 Rev 4 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Footprint (dimensions in mm) Table 3. QSOP28 dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 1.55 1.75 0.061 0.069 a1 0.10 0.25 0.004 0.010 b 0.20 0.30 0.008 0.012 b1 0.18 0.25 0.007 0.010 D 9.80 9.98 0.386 0.393 E 3.80 3.98 0.15 0.157 e 0.64 typ. 0.025 typ. F 5.79 6.20 0.228 0.244 L 0.40 0.90 0.016 0.035 S 8° max 8° max Table 4. Mechanical specifications Lead plating Tin-lead Lead plating thickness 7 µm min. 25 µm max. Lead material Copper Alloy Lead coplanarity 0.102 mm (0.004”) Body material Molded epoxy Resin Meets UL94V-0 standard 28 15 14 1 b a1 e S L E F D b1 A 0.64 0.40 6.70 3.70 1.50 |
Numéro de pièce similaire - ST1284_12 |
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Description similaire - ST1284_12 |
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