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TL331-Q1 Fiches technique(PDF) 2 Page - Texas Instruments |
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TL331-Q1 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 10 page IN+ IN− OUT 80- µA Current Regulator 80 µA 60 µA 10 µA VCC 10 µA OUT GND IN+ IN− Epi-FET Diodes Resistors Transistors COMPONENT COUNT 1 2 1 20 TL331-Q1 SLVS969A – OCTOBER 2009 – REVISED JULY 2010 www.ti.com LOGIC DIAGRAM SCHEMATIC Note: Current values shown are nominal. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage(2) 36 V VID Differential input voltage(3) ±36 V VI Input voltage range (either input) –0.3 V to 36 V VO Output voltage 36 V IO Output current 20 mA Duration of output short-circuit to ground(4) Unlimited qJA Package thermal impedance(5) (6) 206°C/W TJ Operating virtual junction temperature 150°C Tstg Storage temperature range –65°C to 150°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can impact reliability. (6) The package thermal impedance is calculated in accordance with JESD 51-7. 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): TL331-Q1 |
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