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CDCV304TPWREP Fiches technique(PDF) 3 Page - Texas Instruments |
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CDCV304TPWREP Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 13 page CDCV304-EP www.ti.com SCAS927A – MARCH 2012 THERMAL INFORMATION CDCV304 THERMAL METRIC(1) PW UNITS 8 PINS θJA Junction-to-ambient thermal resistance(2) 175.8 θJCtop Junction-to-case (top) thermal resistance(3) 61.8 θJB Junction-to-board thermal resistance(4) 104.3 °C/W ψJT Junction-to-top characterization parameter(5) 7.7 ψJB Junction-to-board characterization parameter(6) 102.6 xxx (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply voltage, VDD 2.3 3.6 V Low-level input voltage, VIL 0.3 x VDD V High-level input voltage, VIH 0.7 x VDD V Input voltage, VI 0 VDD V VDD = 2.5 V –12 High-level output current, IOH mA VDD = 3.3 V –24 VDD = 2.5 V 12 Low-level output current, IOL mA VDD = 3.3 V 24 Operating free-air temperature, TA –40 105 °C TIMING REQUIREMENTS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fclk Clock frequency 0 200 MHz Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): CDCV304-EP |
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