TPS51225, TPS51225B, TPS51225C

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SLUSAV0A – JANUARY 2012 – REVISED JUNE 2012

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VBST1, VBST2

–0.3

32

–0.3

6

SW1, SW2

–6.0

26

VIN

–0.3

26

V

EN1, EN2

–0.3

6

VFB1, VFB2

–0.3

3.6

VO1

–0.3

6

DRVH1, DRVH2

–6.0

32

–0.3

6

–2.5

6

DRVL1, DRVL2

–0.3

6

V

DRVL1, DRVL2 (pulse width < 20 ns)

–2.5

6

PGOOD, VCLK, VREG5

–0.3

6

VREG3, CS1, CS2

–0.3

3.6

HBM QSS 009-105 (JESD22-A114A)

2

Electrostatic

kV

discharge

CDM QSS 009-147 (JESD22-C101B.01)

1

150

°C

–55

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted

(3)

Voltage values are with respect to SW terminals.

THERMAL INFORMATION

TPS51225

TPS51225B

UNITS

TPS51225C

20-PIN RUK

Junction-to-ambient thermal resistance

94.1

Junction-to-case (top) thermal resistance

58.1

Junction-to-board thermal resistance

64.3

°C/W

Junction-to-top characterization parameter

31.8

Junction-to-board characterization parameter

58.0

Junction-to-case (bottom) thermal resistance

5.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2012, Texas Instruments Incorporated

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