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AMC1100DUB Fiches technique(PDF) 2 Page - Texas Instruments |
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AMC1100DUB Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 22 page AMC1100 SBAS562 – APRIL 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE AND ORDERING INFORMATION For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over the operating ambient temperature range, unless otherwise noted. VALUE UNIT Supply voltage, VDD1 to GND1 or VDD2 to GND2 –0.5 to 6 V Analog input voltage at VINP, VINN GND1 – 0.5 to VDD1 + 0.5 V Input current to any pin except supply pins ±10 mA Maximum junction temperature, TJ Max +150 °C Human body model (HBM) ±2500 V Electrostatic discharge (ESD) JEDEC standard 22, test method A114-C.01 ratings, Charged device model (CDM) all pins ±1000 V JEDEC standard 22, test method C101 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. THERMAL INFORMATION AMC1100 THERMAL METRIC(1) DUB (SOP) UNITS 8 PINS θJA Junction-to-ambient thermal resistance 75.1 θJCtop Junction-to-case (top) thermal resistance 61.6 θJB Junction-to-board thermal resistance 39.8 °C/W ψJT Junction-to-top characterization parameter 27.2 ψJB Junction-to-board characterization parameter 39.4 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): AMC1100 |
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