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SB350EB-G Fiches technique(PDF) 1 Page - Comchip Technology

No de pièce SB350EB-G
Description  ESD Leaded Schottky Barrier Rectifiers
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Fabricant  COMCHIP [Comchip Technology]
Site Internet  http://www.comchiptech.com
Logo COMCHIP - Comchip Technology

SB350EB-G Fiches technique(HTML) 1 Page - Comchip Technology

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ESD Leaded Schottky Barrier Rectifiers
QW-BB042
Page 1
REV:A
Electrical Characteristics (at TA=25°C unless otherwise noted)
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.5” (12.7mm) lead length at TA=75°C, See Figure 1
Peak forward surge current
8.3ms single half sine-wave superimposed on rated load
(JEDEC method) TL=110°C
Maximum f
3.0A (Note 1)
orward voltage at
Maximum DC reverse current
At rated DC blocking voltage
Typical junction capacitance (Note 2)
Operating junction temperature range
VRRM
VRMS
VDC
I(AV)
IFSM
VF
IR
CJ
TJ
-65 to +150
V
V
V
A
A
V
pF
°C/W
mA
NOTES:
1. Pulse test : 300µS pulse width, 1% duty cycle.
2.
.
Measured at 1.0MHz and applied reverse voltage of 4.0 Volts
Voltage: 20 to 100 V
Current: 3.0 A
RoHS Device
SB320E-G Thru. SB3100E-G
Dimensions in inches and (millimeter)
DO-201AD
Storage temperature range
Comchip Technology CO., LTD.
3. Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted 0.500” (12.7mm)
pad.
lead length with 2.5x2.5” (63.5x63.5mm) copper
1.0(25.4) Min.
1.0(25.4) Min.
0.375(9.5)
0.287(7.3)
0.210(5.3)
0.189(4.8)
0.052(1.3)
0.048(1.2)
TSTG
°C
°C
Typical t
(Note 3)
hermal resistance
RθJA
RθJL
20
20
40
40
45
45
50
50
60
60
80
80
100
100
14
28
30
35
42
56
70
3.0
-65 to +150
-65 to +125
20
30
40.0
20.0
0.5
0.50
0.85
0.70
250
80
Unit
SB
320E-G
SB
340E-G
SB
345E-G
SB
350E-G
SB
360E-G
SB
3100E-G
SB
380E-G
Features
Mechanical data
-Low drop down voltage.
-
.
3.0A operation at TA=75°C with no thermal runaway
-For use in low voltage, high frequency invertors free
wheeling and polarity protection
.
-Silicon epitaxial planar chips.
-Lead-free part, meet RoHS requirements.
-Epoxy: UL94-V0 rated flame retardant
-Case: Molded plastic body DO-201AD
-Terminals: Solderable per MIL-STD-750 Method 2026
-Polarity: Color band denotes cathode end
-Mounting Position: Any
-Weight: 1.12 grams
-ESD test under IEC6100-4-2 :
Standard: >15KV(Air) & 8KV(Contact)
TA= 25°C
TA=100°C
Comchip
S M D D i o d e S p e c i a l i s t


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